SiCarrier’s Vision for the Future: ASML-Compatible Equipment by 2026
SiCarrier, a Chinese semiconductor equipment firm, plans to launch ASML-compatible lithography machines for 300-mm wafers by 2026. The company is working on enhancing equipment compatibility and securing commercial orders through partnerships with major foundries. SiCarrier also aims to expand its R&D centers and service locations while generating notable advancements in chip manufacturing technology.
SiCarrier, a prominent Chinese chip equipment manufacturer, revealed significant details about its product roadmap during SEMICON China. The firm has developed lithography machines designed for 300-mm wafers utilizing 28nm processes, with intentions to launch an upgraded version compatible with ASML and Applied Materials by 2026, as noted by Anue.
Zhao Min, SiCarrier’s Market Director, emphasized the establishment of a dedicated team focused on enhancing equipment compatibility with those employed by domestic semiconductor fabrication plants. Furthermore, SiCarrier’s Chief Technology Officer, Chen Dong, highlighted collaborations with several fabs to create joint laboratories, forecasting the announcement of their initial commercial orders by late 2025.
SiCarrier boasts an impressive clientele, which includes significant Chinese foundries such as SMIC and Hua Hong Group, and has initiated production of etching equipment used for power semiconductor lines, according to Anue. The company aims to expand its research and development centers to over ten cities within the next three years while also setting up service centers in Europe and Southeast Asia.
Founded in 2022, SiCarrier has garnered attention due to its esteemed leadership. Dai Jun, the technology chief, also supervises China’s Big Fund II and holds a board position at SMIC. Additionally, earlier reports from Bloomberg detail SiCarrier as a state-backed entity working in partnership with Huawei.
SiCarrier made a remarkable impact in 2023 by securing a patent for producing 5nm chips using DUV tools, which is connected to Huawei’s 7nm chip featured in the Mate 60 Pro. At SEMICON China, the company impressed attendees with its diverse array of semiconductor manufacturing equipment, including metrology and inspection systems, despite withholding some details about its lithography tools.
Even in the absence of lithography machines, SiCarrier offers a comprehensive suite of tools that encompass nearly every phase of front-end semiconductor production, including metrology, inspection, and testing equipment, as reported by Tom’s Hardware.
In summary, SiCarrier is establishing a strong presence in the semiconductor manufacturing sector with its plans for ASML-compatible tools by 2026 and consolidated partnerships with major Chinese foundries. The company’s ambitious roadmap includes expanding manufacturing capabilities and R&D centers, as well as securing commercial orders by the end of 2025. SiCarrier’s innovative achievements demonstrate its commitment to advancing semiconductor technology in China and beyond.
Original Source: www.trendforce.com
